Hans chemical chip is filled with glue to escort Chinese drones

In March in spring and spring, the cherry blossoms of Wuhan University were in full bloom as scheduled, but there were fewer appreciators under the tree. However, the epidemic trapped people's footsteps, but could not stop the appreciation of spring. In order to live up to the spring, Wuhan University opened the "cloud cherry blossom viewing" mode. Following the lens of the drone, people across the screen, even thousands of miles away, can still go to a cherry blossom rain appointment and enjoy the "sakura seven days wind and snow".

In addition to taking us to explore the cherry blossoms, as a representative of intelligent manufacturing, drones can be seen everywhere in this war, such as disinfection and protection, sample transportation, and material distribution. The ever-expanding application scenarios put forward higher requirements for the performance of drones, especially in the high-risk, high-intensity working environment such as epidemic prevention and control. High requirements, which requires drones to first have a powerful "heart"-the main control chip.

The main control chip has an important impact on the stability of the UAV, the reliability, accuracy, and real-time performance of data transmission, and plays a decisive role in its flight performance. When the drone is taking off, flying, or landing, there will be vibrations, which will impact the chip electronic components in the drone control board. If the impact is too large, the BGA chip electronic components in the circuit board will be desoldered, causing a short circuit. , Resulting in the phenomenon that the drone cannot work. At this time, the underfill glue of Hans Chemical can be used to dispense around the chip or the bottom of the BGA to reinforce the BGA chip so that it is not easy to fall off, so as to improve the reliability of the product.

Hans Underfill is a one-component, modified epoxy resin adhesive with high reliability, fast flow, easy rework, excellent flux compatibility, capillary flow, high reliability corner reinforcement Equal features. The underfill is mainly used in the BGA, CSP and Flip chip underfill processes. It can form a consistent and defect-free underfill layer, which can effectively reduce the impact caused by the mismatch of the overall temperature expansion characteristics between the chip and the substrate or the external force. After the underfill is cured by heat, the mechanical structure strength after chip connection can be improved and the stability of the product can be improved.

In fact, it's not just drone manufacturing. At present, more and more intelligent manufacturing fields have increasing demand for high-end chips, and the quality requirements for components have become more stringent, which means dispensing and injection Technology and the quality of the adhesive itself must also be improved.

For a long time, Hansi Chemical has always been committed to the research and development and production of high-end chip-level underfill, using advanced US formula technology and imported raw materials to truly achieve no residue and cleanliness. The product has passed SGS certification and obtained RoHS / HF / REACH / 7P test report. The overall environmental protection standard is 50% higher than the industry. The self-developed HS700 series is widely used in many electronic product fields. There are many product selections and mostly professional customizations. It is suitable for the encapsulation and filling of soft and hard boards and soft-hard combined chips. High temperature and reworkable.

In 2020, with the widespread application of new intelligent technologies such as 5G, artificial intelligence, the Internet of Things, cloud computing, and big data, China's intelligent manufacturing industry, including drones, will usher in new opportunities and changes. Facing a new era and new opportunities, Hans Chemical will continue to maintain strong development momentum and strength, and use military quality as a drone company for China and escort for China's intelligent manufacturing.